Panacol胶粘剂在电子组装中的应用
2012-07-01 23:28阅读：
来自德国的胶粘剂专家(隶属Hoenle
Group)，专注于胶粘技术的工业应用，自1976年成立以来在电子、汽车、医疗器械等领域获得广泛的认同。下面大致介绍一下Panacol胶粘剂在PCB电子组装中的应用。
- Application Items
应用项目
- Conformal coating 保形涂层(三防漆)
- SMD adhesives 表面器件贴装胶粘剂
- Glop-top 包封胶
- Flip-chip underfill 倒装底填充胶
- Silicones 硅胶
- UV/UV LED lamps 紫外/紫外LED灯
- Dispensing device technology 点胶设备技术
- Heat sealing/Hot bar soldering/Heat staking
热封/热压焊/热熔焊技术
- Advantages 优势
- Thermally and electrically conductive 可提供不
同类型的导热和导电胶粘剂；
- UV and/or thermally curing 紫外固化和(或)热固化可选；
- Isotropic and anisotropic adhesives
可提供各向同性和各向异性的导电胶粘剂；
- Leading equipment technology 领先的设备技术水平；
- Expertise from a single source
一站式的专业服务。
- Conductive adhesives, die bonding, anisotropic
bonding
导电胶粘剂，芯片键合，各向异性导电接合
- Panacol-Elsol supplies a range of superior electrically and
thermally conductive adhesives.
Their applications range from die bonding, antenna
contacting,
flip-chip through anisotropic bonds and bonding of heatsinks
to HF shielding and 3D-MID.
Panacol提供一系列性能优越的导电导热胶粘剂，其产品应用包括从芯片键合、天线连接、通过各向异性结合实现
的倒装、散热片贴合到高频屏蔽罩及三位模塑互连器件的应用。
- Typical products information 典型产品信息
| Product
No.产品型号 |
Adhesive Types
胶粘剂类型 |
Application
Field应用领域 |
| Elecolit® 6604 |
Therm. Conductive
导热胶
|
measuring instrument sensors
测量仪器感应器
|
| Vitralit® 6138 |
Therm. Conductive
导热胶
|
die-attach, heatsink bonding
芯片贴合，散热片贴合
|
| Elecolit® 3653 |
Electr. Conductive
导电胶
|
flexible parts bonding
柔性部件的贴合
|
| Elecolit® 3043 |
Electr. Conductive |
antenna print, ceramic fuses
天线印刷，陶瓷保险丝
|
| Elecolit® 3061 |
Anisotropic conductive
各向异性导电胶
|
LCD, flexible circuits
液晶显示屏，柔性电路
|
| Elecolit® 3063 |
Anisotropic conductive
各向异性导电胶
|
UV-curing, for flexible circuits
可紫外固化，应用于柔性电路
|
- SMD adhesives, flip-chip
underfills
贴装元件胶粘剂, 倒装底填胶粘剂
- Panacol SMD adhesives are ideal for attaching both large
and small components on printed circuit boards.
不管对于PCB板上的大器件还是小器件，Panacol贴片粘合剂都是非常是重视对大型和小型印刷电路板组件的理想
选择。
- Panacol underfillers are perfect choice for components such
as FC CSPs and FC BGAs for ASICs.
Panacol
underfillers在用于ASIC的芯片级封装(CSP)、BGA封装等的贴装上有着非常出色的表现。
- Advantages: fast flow behaviour; spread readily under large
chips; no cracking, even after thermal shock.
优点：流动迅速；大尺寸芯片下容易扩散；即使在热冲击之后也无裂痕。
- Typical products information 典型产品信息
| Product
No.产品型号 |
Application
Field应用领域 |
| Vitralit® 6104VT |
Mounting large components on PCBs, corner
bonding
PCB大尺寸元件贴装，边角贴合
|
| Structalit® 5604 |
SMD, fast curing, excellent
adhesion
表面贴装器件，快干，出色的结合力
|
| Vitralit® 2665 |
Flip-chip underfill, very low CTE,
Nano-Filler
倒装底填充，非常低的膨胀系数，纳米级填料
|
| Vitralit® 2675 |
Flip-chip underfill, high chemical/physical
resist.
倒装底填充，出色的抗化学品及物理冲击能力
|
| Vitralit® 2685 |
Flip-chip underfill, very low
shrinkage,
ideal for parts subjected to impact testing
倒装底填充，低收缩率，是需要进行冲击测试元件的理想选择
|
- Conformal coating, glob-top, dam &
fill
保形涂层(三防漆)，包封，围堰及填充
- To protect PCBs and chips from environmental factors,
Panacol has developed special conformal
coatings. These have already been proven in many applications
in the automotive, electronics,
medical systems and other industries. Our product expertise
also covers glob-top sealants and dam& fill.
为了保护印刷电路板和各种chip元器件，Panacol开发了一系列具有针对性的保形涂层。经过多年的应用，
Panacol的保形涂层产品已经在汽车、电子、医疗系统和其它行业获得广泛认同。另外，Panacol专长的产品
还包括glob-top密封胶和围堰及填充胶。
- Typical products information 典型产品信息
| Product
No.产品型号 |
Application
Field应用领域 |
| Vitralit® 2009 F |
Conf. coating, flexible, UV- and thermally
curing
保形涂层，柔软性好，紫外及热固化
|
| Vitralit® 4451 |
Conf. Coating, foil bonding, low
shrinkage
保形涂层，箔材贴合，低收缩率
|
| Vitralit® 1691 |
Glob-top, black, high temperature
resistance
包封应用，黑色，耐高温
|
| Vitralit® 1657 |
Glob-top, for large/tall parts,
thixotropic
大尺寸元件的包封应用，有触变性
|
| Structalit® 5892 |
Glob-top, black, excellent
adhesion
包封应用，黑色，极好的结合力
|
| Vitralit® 1671 |
Dam, stable, can be used
wet-in-wet
围堰胶，稳定，可在不干面应用
|
| Vitralit® 2583 |
Liquid sealant, dry surface,
elastic
液态密封胶，表面干燥，弹性好
|
- Heat sealing, hot bar solderingheat
staking
热封/热压焊/热熔焊技术
- Panacol supplies intelligent compatible systems designed
specifically for use in LCD and PCB
production.
> Optimised production processes for best quality
> Minimised defect rates, low production costs
The design and equipment of each device type can be tailored
to customers' specific production requirements.
Naturally they can also be integrated within existing
production processes.
Panacol为PCB和LCD生产应用设计了高智能兼容性系统：
> 优化生产流程以达到最好品质；
> 减少坏品率，降低生产成本。
每个应用单元可以根据客户的需求提供个性化的设计及设备。当然，这些应用单元被集成于现有的生产流程当中。
- Dispensing 点胶工艺
Panacol have the perfect dispensing devices for all your
needs – from standard machines to highly
specialised equipment. Ideal for precisely dispensing
application of various low- and high-
viscosity materials. And we also have the suitable
accessories.
为满足客户的需求，Panacol可提供非常优良的点胶设备——从标准机到高度个性化的设备，为客户精确各种高低
粘度胶粘剂的点胶流程提供了理想选择。同时Panacol也提供各种相应配件。
- UV/UV LED technology
紫外/紫外LED固化技术
Ideally suited for curing adhesives, coatings, sealants and
paints, Hönle UV and UV LED lamps are
the ideal addition to our UV products. UV LED arrays and UV
LED flood lamps: the innovative UV
technology that cures without heat generation!
好乐的紫外灯和紫外LED灯非常适合于各种粘合剂，涂层，密封剂和涂覆漆的固化，是Panacol紫外固化类胶粘剂的理想选择。而好乐的紫外LED阵列及紫外LED面光源作为最新的创新UV技术，在固化过程中几乎不产生热量。
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备注：
1. 信息来源: http://www.panacol.de
2. 更多信息请联系: xiaoyun.chen@hoenle.cn
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