电子不良现象代码(中英)
2010-02-25 18:03阅读：
electrical component pin oxided電子零件不吃錫
SMT component up side 側立
PCB liniNG short PCB內層短路
electrical component open internally 電子零件內部開路
peripheral parts shift and stone cause NTF
週邊零件移位側立造成誤判
PCB pad is dirty PCB pad贓污
passed by socket board verified but failed at 2rd on board f/t
BGA二次上板NG testiNG open for SMT cold solder SMT component 冷焊導致ICT 測試
open
PCB oxided damaged
PCB銅綠斷線造成孔不良
MB repaired,component pendiNG verification 板子修好待驗證零件
DIP component reversed DIP製程零件反向
PCB path open PCB線路斷線
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parts oxidization 零件氧化
DIP missiNG component DIP製程未上零件
PCB path short PCB線路短路
lower of impedance ICT測試阻抗值偏低,f/t和ort驗證ok
DIP wroNG component
DIP製程上錯零件
PCB pad oxided PCB pad不吃錫
SMT component reversed SMT製程零件反向
DIP excess object
DIP製程異物介入製程
PCB through hole broken PCB貫孔不通
SMT missiNG component SMT製程未上零件
DIP cold solder DIP製程焊接不確實
PCB solderiNG (golden fiNGer) PCB金手指沾錫
SMT wroNG component SMT製程上錯零件
DIP solderiNG short DIP製程焊錫短路
PCB (golden fiNGer) PCB 金手指沾膠
SMT excess object SMT製程異物介入製程
DIP solderiNG (golden fiNGer) DIP製程金手指沾錫
PCB BGA though PCB BGA
貫孔露銅
SMT solderiNG short SMT製程焊錫短路
DIP component incline
DIP製程零件加工歪斜
colden fiNGer be scratched
金手指刮傷
SMT solderiNG (golden fiNGer) SMT製程金手指沾錫
DIP component float DIP製程零件加工浮件
golden fiNGer is dirty 金手指髒污
SMT component shift SMT製程零件置件移位
DIP component bent lead DIP製程零件跪腳
mec component bad 機構零件本體不良
SMT tombstone SMT製程立碑
DIP制程溢錫或溢錫短路
mec component short 機構零件內部短路
SMT component tilt lead SMT製程零件翹腳
DIP missiNG label
DIP製程缺標簽
mec component pin oxided
機構零件不吃錫
SMT wroNG location SMT製程上錯位置
DIP wroNG location DIP製程上錯位置
electrical component bad 電子零件本體不良
SMT rework NG SMT維修不良
DIP cold solder DIP制程冷焊
electrical component short 電子零件內部短路
SMT insufficient solder
SMT 制程少錫
DIP insfficent solder DIP 制程錫少
psg 壓件
SMT component up side down SMT 零件反貼
DIP component excess solder DIP 制程零件錫過飽
SMT excess solder 多錫
SMT cold solder SMT 制程冷焊
DIP solder ball DIP制程錫珠
PCB pad damaged 撞件造成PCB掉pin
fm radio can not catch a clear channel fm
radio抓不到清晰頻道
device no find 找不到光碟機(測試程試不運行)
pdj connecter 被治具插壞
set rma to repair 轉rma維修
drive initialize failure 光碟機初始化失敗
test missiNG label 測試缺標簽
component damaged 零件受外力撞擊破裂,斷腳
inside transfer rate fail 內軌傳輸率在測試中失敗
pack component reversed 包裝零件反向
component burned 零件燒毀
transfer rate too low 最大傳輸率在測試中失敗
pack component incline 包裝零件加工歪斜
PCB path burned PCB線路燒斷
'random stroke ,any access time at once over or failure'
'隨機行程,任單一次access失敗或超過時間'
pack missiNG component 包裝未上零件
PCB path broken
PCB外力造成之斷線
'full stroke ,any access time at once over or failure'
'全沖程,任單一次access失敗或超過時間。'
pack wroNG component 包裝上錯零件
PCB path short PCB外力造成之短路
inside transfer rate too low 內軌傳輸率太慢
pack missiNG label 包裝缺標簽
component bent lead 客戶更動零件跪腳 (不含廠內)
transfer rate too low 最大傳輸率太慢
rework 更動線路或零件
component reversed 客戶將零件插反 (不含廠內)
random stroke average time over or failure
隨機沖程平均 時間失敗或超時
clear cmos 清除cmos資料
component tilted 零件受外力撞擊歪斜
'full stroke ,access time too low'
'全行程,平均讀取時間太慢'
last time t/r fail 前次維修造成失效
lossiNG component 零件掉失
jitter test NG jitter
測試測試值超出規格
cmos rtc timiNG delay cmos 時間延遲
wroNG component 客戶自行換錯零件
button no function 按鍵無作用
socket pin deformation
腳座擴孔變形
excess object 外來異物介入
connect gpib fail 連接gpib 失敗
re- assemble machine ok 重新組裝ok
wroNG jumper settiNG
排針設定錯誤
can not initialize power meter
不能初始化power meter
re-assemble lcm ok lcm 重新組裝ok
wroNG cmos setup cmos設定錯誤
output read power error
輸出讀功率錯誤
other ,replace board 其它原因交換面板測試ok
damaged by user 嚴重損壞,不予維修
output write power 1 error 輸出寫功率1錯誤
capacitor brief short 電容瞬間短路
out of warranty 超過保固期,已無零件替換
output write power 2 error 輸出寫功率2錯誤
DIP circuit test fall DIP 電流測試不良
update bios 更新bios版本
output overdriver write power 1 error 輸出最大功率1錯誤
customer induced defect 客戶要求重工導致的不良
reflash bios 重燒bios資料
output overdriver write power 2 error 輸出最大功率2錯誤
DIP current test fail DIP 電流測試不良
no component, chaNGe m/b 保固內,無零件,交換機板
led no bright or led bright abnormal
led燈不亮或燈亮異常
waive material 特採零件
set rma to
repair 轉rma維修 pick-up to hit the spindle motor
pick-up撞擊spindle motor
component bad for consign material 客戶指定使用零件不良
defect 報廢
pick-up sled home action
pick-up不動
repair determinant as component bad but no socket board test wait
test component
維修判定為BGA不良但沒有用socketboard待驗證的零件
set rma to repair 轉rma進行維修
key read power 1 fail 調整讀功率 1失敗
DIP crystal test fall DIP 晶振測試不良
refresh firmwire 重新刷分位
key read power 2 fail 調整讀功率 2失敗
no ready for CD-rom disc CD-rom碟不讀
forward 向前傾斜
key write power 1 fail 調整寫功率1失敗
no ready for CD-r disc
CD-r碟不讀
backward 向後傾斜
key write power 2 fail 調整寫功率2失敗
no ready for CD-rw disc CD-rw碟不讀
sideways 向側面傾斜
run in time out run in時間過長
DIP solder over flow ( short ) DIP製程溢錫或溢錫短路
broken 斷掉
CD-r write speed
fail CD-r寫入速度失敗
no problem found 一切正常
bent up
彎屈
data compare fail
數據比對失敗
ICT fault alarm ICT測試誤判
socket t mode 1 failure socket t
模式一外觀不良
opc(optimum power control) fail
最佳功率校正錯誤
component passed socket board test for initial verification
母板驗證零件為良品 socket t mode 2 failure
socket t 模式二外觀不良
a normal write error which can improve
immediately 一般性可立即恢復的錯誤
the qfp was NG but test ok with a new qfp replaced,then re-board
the NG qfp on the same PCBA and the failed symptom disappeared.
維修將判定為不良的qfp零件拖錫後不良現象依舊，更換新的零件測試ok,但將不良零件重新焊接到原來的產品後不良現象消失
socket t mode 3 failure socket t
模式三外觀不良
CD-rw write speed fail
CD-rw寫入速度失敗
ebt fail ebt 測試fail後需測試16x
socket t mode 4 failure socket t
模式四外觀不良
DIP power test fall DIP
電壓測試不良
gpu/memory failure for n2 model
n2機種gpu或memory 不良
socket t mode 5 failure socket t
模式五外觀不良
rd design issue 設計問題
audio waveform error 音頻波形異常
tray automatic trayin/out tray盤自動進出
model name error model
name錯誤
audio no output 無音樂輸出
tray in/out noise tray盤自動進出異音
play audio error 播放音樂失敗(喇叭輸出音量不正常)
siNGle waveform 單波
tray out fail tray盤不出
line out out put error line out 聲音輸出不良(示波器輸出不正常)
siNGle voice 單音
tray in fail tray盤不進
firmware error 韌體版本不正確
output audio noisy 輸出音樂有雜音
tray in/out time out of spec
tray盤進出緩慢
fly disc tray盤出來時碟片還在轉動
volume knob not rotatiNG smoothly 音量開關旋轉不順
write rate low than spec 寫入速度不符合參考檔設定
writ verify c1/c2 燒錄完畢後比對c1orc2過大
volume knob rotation audio noisy
音量旋轉時輸出音樂雜音
writ date verify error 寫入資料比對有錯
