多官能团环氧树脂 multifunctional epoxy resin
2017-06-05 15:03阅读:
缩水甘油胺类
普通AG-80(Araldite MY-720,
XB-9721,RoyOxy RAR
920,Epiclon 430, SUMI-EPOXY ELM-434,jER
604,SE-320)
CAS#31305-94-9
N,N,N',N'-Tetraglycidyl-4,4'-methylenebisbenzenamine(TGDDM)
4,4'- 二氨基二苯甲烷环氧树脂
Viscosity @ 50°C (122°F), cP :8,
000-18,000, mPas
EEW:
117-134 g/Eq
高纯AG-80(Araldite MY 721,SE-320P,EPIKOTE
Resin 496,RoyOxy RAR 921)
Viscosity @ 50°C (cP), (mPas) 3,000 - 6,000
EEW:
109-116 g/Eq
普通AFG-90(Araldite MY 0500,jER 630,SE-300),
CAS#5026-74-4
Triglycidylether of para-aminophenol (TGPAP)
三缩水甘油基对氨基苯酚
Viscosity at 25°C: 2 000 – 5 000 mPa.s
EEW: 100 – 115 g/Eq
高纯AFG-90(Araldite MY 0510,jER
630LSD,SE-300P,EPIKOTE Resin 498)
Viscosity at 25°C: 550 – 850 mPa.s
EEW: 96 – 106 g/Eq
Araldite MY 0600, CAS#71604-74-5
Triglycidylether of meta-aminophenol (TGMAP)
三缩水甘油基间氨基苯酚
Viscosity at 25°C: 7 000 – 13 000 mPa.s
EEW: 91 – 98 g/Eq
Tg(DMA):
225-240°C(with DDS, Cure schedule 3 h
@ 120°C + 1 h @ 160°C + 2 h @ 180°C)
Araldite MY 0610(EPIKOTE Resin 400), Distilled
TGMAP
Viscosity at 25°C: 1 500 – 4 800 mPa.s
EEW: 94 – 102 g/Eq
EPALLOY GA-240(TETRAD X),CAS#63738-22-7
环氧化间苯二甲胺
Viscosity at 25°C, cps 1,600 - 3,000
EEW: g/eq 95 - 110
TETRAD C,CAS#65992-66-7
1,3-双(N,N-二缩水甘油氨甲基)环己烷
Viscosity at 25°C, cps 1,600 - 3,000
EEW: g/eq 95 - 110
其他类型
Tactix 742(ARTF-34,Atul),CAS#66072-38-6
triglycidyl ether
of tris (hydroxyphenyl)
methane
Softening point:45 - 55 [°C]
Viscosity at 79 °C (ISO 9371B) :2860[mPa s]
EEW :
150-170[g/eq]
Tg~299°C(with DDS), DSC
Tg~254°C (with Nadic Methyl Anhydride)
Tg~218°C(with MHHPA)
EPALLOY 9000,CAS#87093-13-8
1, 1,
1-tris-(p-Hydroxyphenyl) Ethane Glycidyl
Ether
Viscosity @ 72°C, cps 5,500 - 6,500
EEW, g/eq 160 - 180
Tg~282°C (with Nadic Methyl Anhydride)
Tg~220°C (with MHHPA)
Epon 1031,XB 4399-3,CAS#7328-97-4
tetraglycidyl ether of tetrakis
(4-hydroxyphenyl) ethane
Melt Viscosity @ 150°C:15
dPa·s
EEW, g/eq 195 - 230
Tg~239°C (with Nadic Methyl Anhydride)
Tg~227°C (with MHHPA)
二萘型环氧树脂
1,6–naphthalene diepoxy,CAS#27610-48-6
Araldite MY 0816,EPICLON HP-4032
Viscosity at 25°C: 25 000 – 80 000 mPa.s
Viscosity at 50°C: 1500 – 2500 mPa.s
EEW:133 – 154 g/eq
Tg(DMA)~223°C (with 4,4'-DDS, 2h at 150°C + 4h at 180°C + 2h at
200°C)
Tactix 556(Taxtix 756,EPICLON HP-7200)
dicyclopentadiene-phenol glycidylether resin
Softening point: 53 [°C]
Viscosity at 79 °C (ISO 9371B): 2250 [mPa s]
EEW: 215 - 235 [g/eq]
Tg(DMA):234°C (4,4'-DDS,Cure schedule 1h/177°C +2h/232°C)
TECHMORE VG3101,Mitsui Chemicals
EEW:210 g/eq
Softening point: 61 [°C]
HDT~192℃, with DICY
HDT~212℃, with NMA
HDT~272℃, with DDM
cure schedule 120℃x2hr+160℃x2hr+190℃x4hr
-------
根据公开资料整理,大部份是比较常见的,以后有空再整理下更特殊的,有兴趣多交流。这些树脂虽然耐温性都很高,但刚性很大,黏度也比较大,所以在实际使用时,往往必须外加增韧剂,而增韧剂的黏度往往更高,PES类更是固体,操作工艺性比较差,所以如果要用它来做耐高温的真空灌注,RTM系统,低粘度、高韧性、高Tg往往很难兼顾,所以如果只使用这些树脂,是很难满足要求的,对于其他特殊结构的树脂/固化剂,还需从分子结构设计上下功夫。