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粉末颗粒真密度测定-比重瓶法介绍

2018-03-21 08:29阅读:
粉末颗粒真密度测定-比重瓶法介绍 FT-600 series of powder particle true density measuring device- Pyknometer method
1.概述Outline
比重瓶法测定粉体真密度基于阿基米得原理.将待测粉末浸入对其润湿而不溶解的浸液中, 抽真空除气泡,求出粉末样品从已知容量的容器中排除已知密度的液体,就可计算所测粉末的真密度。比重瓶法具有仪器简单,操作方便,结果可靠等优点,已成为目前应用较多的测定真密度的方法
The true density with pycnometer method based on the Archimedes principle. Dip the test powder sample into the wet and undissolved liquid, Vacuum bubble , It can be calculated the true density of the powder by eliminating the known density of liquid from the container of the known capacity.The Pyknometer method has the advantages of simple instrument, convenient operation and reliable result, which has become the method of measuring true density with more application.
二、适用范围scope of application
广泛用于水泥业、粉末冶金、制药、化工、橡塑料粉末、研磨材料、陶瓷原材料、炭素材料、防火材料、石材业、土壤、颜料、岩石与煤、树脂颗粒、多孔性颗粒、粉末理论真密度研究实验室、大专院校、科研机构及企业研究.
Widely used in cement industry, powder metallurgy, pharmaceutical, chemical, rubber and plastic powder, abrasive materials, ceramic raw materials, carbon material, fireproof material, stone, soil, pigment, pigments, rock and coal, resin particles, porous granular Powder theory true density research laboratory, universities and colleges, scientific research institutions and enterprises research.
三、满足标准standard
TM C 97 ASTM D 5004ASTM C329\217 DIN51057 GB/208GB/T9966GB/T1033.1GB/T 23561GB/T24203GB/T8330等标准要求。
Meet standard: TM C 97, ASTM D 5004, ASTM C329\217, DIN51057, GB / 208, GB/T9966, GB/T1033.1, GB/T 23561, GB/T24203, GB/T8330, etc Standard requirement.
粉末颗粒真密度测定-比重瓶法介绍

三、 功能介绍function introduced
依据阿基米得原理,本机提供提供多种测试模式,可以测试固体材料(排水法)、液体( 定体积法)、粉末和颗粒(比重瓶置换法)操作简单、准确性高、无需人工计算,测量结果直接读数、具有防风、防尘、防振、水平定位功能。采用高精度AD芯片技术,高集成模块测量。
On the basis of Archimedes’ principle ,this machine offers a variety of test mode, you can test solid materials (drainage method), liquid (constant volume method), powder and granule (pycnometer displacement method) of simple operation, high accuracy, no artificial calculation, measuring result directly reading, With windproof, dustproof, antivibration, level positioning function.High precision AD chip technology, high integration module measurement.

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