ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme
2024-04-14 06:28阅读：
新浪博客
e copper.
Process Parameter Table for Direct Acid Copper Electroplating of Welding Wire
The optimal value of copper sulfate pentahydrate is 60-120g/l and 80g/l
Sulfuric acid (industrial) 40-70g/l 50g/l optimal value
The optimal value of DW-035C copper plating stabilizer 5-25g/l 10g/l
The optimal value of cathode current density is 10-30A/dm2, 20A/dm2
Temperature 20-50 , optimal value of 35
Time 0.5-3 seconds 2 seconds
Anode: Phosphorus copper plate slot voltage 2.5-4.5V
When preparing the initial tank, the stabilizer is first prepared at 5g/l and gradually increased to 10g/l
Addition method
KAH (kiloampere hour) must add 200-300g of DW-035C welding wire high-speed electroplating copper stabilizer, or add 50-100g of stabilizer to one ton of welding wire
The average particle size of the copper coating in the welding wire with DW-035C high-speed copper plating stabilizer added is below 600nm, and the power supply and arc stability are particularly good, improving the adhesion of the copper immersed layer on the steel wire. The H and Fe content in the coating is minimized, and the copper plating layer is dense, especially suitable for copper plating on low-carbon steel wire, copper plating on high-strength welding wire, and electrolytic copper plating on stainless steel wire.
Adding DW-035C welding wire high-speed copper plating stabilizer can quickly form an electrochemically deposited copper layer on the steel substrate under electrification conditions, resulting in the rapid formation of a dense copper layer on the substrate surface, thereby isolating direct contact between the acidic plating solution and the substrate, completely stopping the displacement reaction, and ensuring that the copper plating layer has a strong bonding force.
The process of depositing copper film to facilitate wire drawing. It can cause orderly deposition of copper ions, making copper deposition dense and with strong adhesion. At the same time, the increase of divalent iron is effectively suppressed, eliminating the trouble of frequent addition of copper sulfate. The film weight of copper film generated is 2-30g/m2.
Adjustable film thickness, increasing copper sulfate to increase thickness, increasing current to increase thickness.
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![ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme]( "ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme")
Electrolytic copper plating wire
Material saving process for dense, uniform, and non porous copper layers
Suitable for wet and dry wire drawing up to 30 m/sec.
With electrolytic pretreatment
For SAW and CO2 welding wires with diameters ranging from 0.8 mm to 4.0 mm
And low and medium alloy quality
![ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme]( "ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme")
Front view of copper plating device
![ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme]( "ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme")
Rear view of copper plating device
In electroless copper plating, copper is deposited on the surface of the wire by exchanging iron with copper ions. This exchange process is used for electroplating. The entire process is a so-called redox process, in which the separation of copper and iron, which serve as the reduction process, enters the solution. During the sedimentation process, copper is always converted into an equal amount of iron ions
The solution diffusion through the growing copper layer must leave a fine pore on the copper surface. The continuous increase of iron ions makes the copper plating bath unusable at a certain iron concentration and must be discarded.
In the DW-035C process, copper ions dissolved in an acid bath are deposited on the surface of the wire through an external voltage source. This is also an oxidation-reduction process. Compared to electroless copper plating, however, only electrons (from a voltage source) are used in the deposition process. The extensive exchange of iron and copper does not result in the dissolution of iron from the wires.
Copper dissolved in the form of particles (balls) in the anode basket to maintain a constant concentration of copper ions.
The process of dissolving particles is almost the same as the amount of copper previously deposited on the wire in the solution.
Therefore, only copper is required as the raw material for the bathroom and cannot be exchanged or disposed of.
The anode basket is arranged in this way in the copper plating tank, and the operator can open and refill the basket with new copper balls on the bathtub cover during the production process. There is no need to stop the system for this.
The anode basket itself is made of high-quality titanium alloy
The crystal form of electrolytic deposited copper layer is denser, more uniform, and has fewer pores compared to chemically deposited copper layer. A non porous copper layer can prevent corrosion issues during storage or transportation of copper salts or acid residues stored in the pores. This is because no iron must pass through the copper layer and the applied DC copper ions must be uniformly deposited throughout to ensure the surface of the wire.
The comparative measurement of surface roughness between chemical and electrolytic deposited copper layers resulted in RA values ranging from 0.2 µ to 0.1 µ. A significantly smoother surface of DW-035C was measured on the welding test bench
It shows that the feed force required to push the wire through the hose package is significantly reduced.
In the DW-035C high-speed electrolytic copper plating process, copper ions dissolved in the acid bath are supplied by an external power source
Deposited on the surface of the wire. However, compared to self catalytic copper plating (displacement copper plating), only electrons (from the power source) are attracted. There will be no material exchange (copper for iron) that dissolves iron from the metal wire.
To maintain a constant concentration of copper ions, only copper needs to be provided as the raw material; The bathtub does not need to be replaced or disposed of.
If traditional chemical copper plating is combined with
The serious advantages of DW-035C process and electrolysis process have been determined. Due to the constantly rising prices
Metals and precious metals (such as copper) should be used with caution as these raw materials become increasingly important, as there is a large
This saving potential is available. Refusal is like this. The concentration of waste copper sulfate bath
The unused copper is still around 30 grams per liter, which is equivalent to 30 kilograms in a 1000 liter bathtub. Then neutralize and deposit these copper with iron and acid, resulting in significant costs.
Electrolytic copper plating will not result in scrap of the plating solution due to the increase of iron ions
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![ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme]( "ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme")
![ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme]( "ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme")
The key to electrolytic copper plating is the electrodes and their arrangement. A simple power supply but competing with a sulfuric acid electrolysis tank can cause unstable current in the copper plating tank, and the copper plating layer is prone to blooming. The optimal arrangement is for two power sources to supply power. In addition, the surface of titanium blue electrolysis must be coated with an iridium tantalum conductive layer to make the copper particles in good contact with the conductive layer and conduct current better, so that the copper particles can dissolve well without adding copper sulfate, and the ferrous sulfate will not increase. Otherwise, the copper particles cannot dissolve well and need to be supplemented with copper sulfate. At this time, replacing copper plating will easily cause copper powder to form, and also cause the ferrous sulfate to increase. At the same time, the coating cannot meet the standard and is not corrosion-resistant.
Anode layout diagram for high-speed electrolytic copper plating of wire
The key to electrolytic copper plating is the electrodes and their arrangement. A simple power supply but competing with a sulfuric acid electrolysis tank can cause unstable current in the copper plating tank, and the copper plating layer is prone to blooming. The optimal arrangement is for two power sources to supply power. The copper plating tank is connected to the pickling tank and separated independently.![ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme]( "ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme")
The pickling tank is equipped with an additional rectifier for power supply. In addition, the surface of titanium blue electrolysis must be coated with an iridium tantalum tin conductive layer to make the copper particles in good contact with the conductive layer and conduct current better, so that the copper particles can dissolve well without adding copper sulfate, and the ferrous sulfate will not increase. Otherwise, the copper particles cannot dissolve well and need to be supplemented with copper sulfate. At this time, replacing copper plating will easily cause copper powder to form, and also cause the ferrous sulfate to increase. At the same time, the coating cannot meet the standard and is not corrosion-resistant.
Attachment: Application Study of DW-035C Welding Wire High speed Electrolytic Copper Plating Process in Gas Shielded Welding Wire
The electrolysis process of depositing copper on steel wires, in which the steel wires pass through an acidic electrolysis cell containing copper aqueous solution, and the copper ions come from copper sulfate. Direct current flows through a solution between at least one pair of anodes. The anode is made of titanium blue with copper particles or buckles, and titanium blue needs to be coated with a conductive coating of iridium tantalum tin. And it is necessary to regularly supplement copper particles, and appropriately supplement copper sulfate by analyzing the copper sulfate content in the plating solution (controlling the anode and copper particles well does not require supplementing copper sulfate).
In the acidic copper plating process of steel wire, 'bonding' phenomenon occurs, which is a corrosion and displacement reaction. Copper ions in the solution deposit more preferentially than iron in the wire, and are reduced to metallic copper, while iron is oxidized to ferrous ions and enters the solution. The copper layer deposited on the steel wire in this way has the disadvantage of being powdery and having poor adhesion.
When using the DW-035C welding wire high-speed electrolytic copper plating stabilizer process, there will be no 'bonding' phenomenon, which will not cause copper powder deposition, increase the adhesion between copper and steel wire, and reduce the pores of the copper plating layer. Therefore, the copper plating of the welding wire produced by the new process is not easy to change color, and the corrosion resistance is significantly improved.
And the flow rate of the electrolyte solution between the anode and the cathode is about 0.2 to about 5 meters per second.
The 'electrolytic copper plating' coating has a denser and finer particle coating and excellent adhesion to the surface of the welding wire. The smooth surface of the welding line can reduce resistance, allowing it to smoothly perform at extremely high feed rates during spray arc transfer, which is beneficial for automated welding.
In addition, the quality of crystalline coatings is denser, more uniform, and pore free, thereby avoiding corrosion problems caused by transportation and storage.
In this article, a synergistic effect of 1+1 greater than 2 is achieved through the combination of adsorbents, antioxidants, and strong acids, effectively suppressing the 'iron copper chemical displacement' under acidic conditions. This allows the steel substrate to form a firmly bonded nucleated copper layer at the moment of contact with acidic copper plating solution, rather than a loose sponge copper structure; It is widely known in the industry that sponge copper has no binding force with the substrate and subsequent copper plating layer, while the nucleated copper layer under acidic conditions has good binding force with the substrate; At the same time, an electrochemically deposited electroplating copper layer can be quickly formed on the steel substrate under electrification conditions, resulting in the rapid formation of a dense copper layer on the surface of the substrate, thereby isolating direct contact between the acidic plating solution and the substrate, completely stopping the displacement reaction, and ensuring that the copper layer has a strong bonding force.
After using this new technology, welding wire enterprises can directly reduce costs.
![ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme]( "ComparativeanalysisofDW-035Chigh-speedelectrolyticcopperplatingandhigh-speeddisplaceme")
From the above figure, it can be seen that the chemical plating coating is rough, with pores and small pores, but not shiny. The surface of the electrolytic copper plating is shiny and flawless, and the bare wire is not shiny and rough.
benefit
The processing time is very short, with a processing speed of up to 30 m/sec.
Due to the increase in iron concentration, there is no bath pollution
Reduce copper consumption
Dense/uniform non porous copper layer
By comparison, production costs have been reduced by 50%
Process Parameter Table for Direct Acid Copper Electroplating of Welding Wire
The optimal value of copper sulfate pentahydrate is 60-120g/l and 80g/l
Sulfuric acid (industrial) 40-70g/l 50g/l optimal value
The optimal value of DW-035C copper plating stabilizer 5-25g/l 10g/l
The optimal value of cathode current density is 10-30A/dm2, 20A/dm2
Temperature 20-50 , optimal value of 35
Time 0.5-3 seconds 2 seconds
Anode: Phosphorus copper plate slot voltage 2.5-4.5V
When preparing the initial tank, the stabilizer is first prepared at 5g/l and gradually increased to 10g/l
Addition method
KAH (kiloampere hour) must add 200-300g of DW-035C welding wire high-speed electroplating copper stabilizer, or add 50-100g of stabilizer to one ton of welding wire
The average particle size of the copper coating in the welding wire with DW-035C high-speed copper plating stabilizer added is below 600nm, and the power supply and arc stability are particularly good, improving the adhesion of the copper immersed layer on the steel wire. The H and Fe content in the coating is minimized, and the copper plating layer is dense, especially suitable for copper plating on low-carbon steel wire, copper plating on high-strength welding wire, and electrolytic copper plating on stainless steel wire.
Adding DW-035C welding wire high-speed copper plating stabilizer can quickly form an electrochemically deposited copper layer on the steel substrate under electrification conditions, resulting in the rapid formation of a dense copper layer on the substrate surface, thereby isolating direct contact between the acidic plating solution and the substrate, completely stopping the displacement reaction, and ensuring that the copper plating layer has a strong bonding force.
The process of depositing copper film to facilitate wire drawing. It can cause orderly deposition of copper ions, making copper deposition dense and with strong adhesion. At the same time, the increase of divalent iron is effectively suppressed, eliminating the trouble of frequent addition of copper sulfate. The film weight of copper film generated is 2-30g/m2.
Adjustable film thickness, increasing copper sulfate to increase thickness, increasing current to increase thickness.
·
Electrolytic copper plating wire
Material saving process for dense, uniform, and non porous copper layers
Suitable for wet and dry wire drawing up to 30 m/sec.
With electrolytic pretreatment
For SAW and CO2 welding wires with diameters ranging from 0.8 mm to 4.0 mm
And low and medium alloy quality
Front view of copper plating device
Rear view of copper plating device
In electroless copper plating, copper is deposited on the surface of the wire by exchanging iron with copper ions. This exchange process is used for electroplating. The entire process is a so-called redox process, in which the separation of copper and iron, which serve as the reduction process, enters the solution. During the sedimentation process, copper is always converted into an equal amount of iron ions
The solution diffusion through the growing copper layer must leave a fine pore on the copper surface. The continuous increase of iron ions makes the copper plating bath unusable at a certain iron concentration and must be discarded.
In the DW-035C process, copper ions dissolved in an acid bath are deposited on the surface of the wire through an external voltage source. This is also an oxidation-reduction process. Compared to electroless copper plating, however, only electrons (from a voltage source) are used in the deposition process. The extensive exchange of iron and copper does not result in the dissolution of iron from the wires.
Copper dissolved in the form of particles (balls) in the anode basket to maintain a constant concentration of copper ions.
The process of dissolving particles is almost the same as the amount of copper previously deposited on the wire in the solution.
Therefore, only copper is required as the raw material for the bathroom and cannot be exchanged or disposed of.
The anode basket is arranged in this way in the copper plating tank, and the operator can open and refill the basket with new copper balls on the bathtub cover during the production process. There is no need to stop the system for this.
The anode basket itself is made of high-quality titanium alloy
The crystal form of electrolytic deposited copper layer is denser, more uniform, and has fewer pores compared to chemically deposited copper layer. A non porous copper layer can prevent corrosion issues during storage or transportation of copper salts or acid residues stored in the pores. This is because no iron must pass through the copper layer and the applied DC copper ions must be uniformly deposited throughout to ensure the surface of the wire.
The comparative measurement of surface roughness between chemical and electrolytic deposited copper layers resulted in RA values ranging from 0.2 µ to 0.1 µ. A significantly smoother surface of DW-035C was measured on the welding test bench
It shows that the feed force required to push the wire through the hose package is significantly reduced.
In the DW-035C high-speed electrolytic copper plating process, copper ions dissolved in the acid bath are supplied by an external power source
Deposited on the surface of the wire. However, compared to self catalytic copper plating (displacement copper plating), only electrons (from the power source) are attracted. There will be no material exchange (copper for iron) that dissolves iron from the metal wire.
To maintain a constant concentration of copper ions, only copper needs to be provided as the raw material; The bathtub does not need to be replaced or disposed of.
If traditional chemical copper plating is combined with
The serious advantages of DW-035C process and electrolysis process have been determined. Due to the constantly rising prices
Metals and precious metals (such as copper) should be used with caution as these raw materials become increasingly important, as there is a large
This saving potential is available. Refusal is like this. The concentration of waste copper sulfate bath
The unused copper is still around 30 grams per liter, which is equivalent to 30 kilograms in a 1000 liter bathtub. Then neutralize and deposit these copper with iron and acid, resulting in significant costs.
Electrolytic copper plating will not result in scrap of the plating solution due to the increase of iron ions
·
·
·
·
·
·
The key to electrolytic copper plating is the electrodes and their arrangement. A simple power supply but competing with a sulfuric acid electrolysis tank can cause unstable current in the copper plating tank, and the copper plating layer is prone to blooming. The optimal arrangement is for two power sources to supply power. In addition, the surface of titanium blue electrolysis must be coated with an iridium tantalum conductive layer to make the copper particles in good contact with the conductive layer and conduct current better, so that the copper particles can dissolve well without adding copper sulfate, and the ferrous sulfate will not increase. Otherwise, the copper particles cannot dissolve well and need to be supplemented with copper sulfate. At this time, replacing copper plating will easily cause copper powder to form, and also cause the ferrous sulfate to increase. At the same time, the coating cannot meet the standard and is not corrosion-resistant.
Anode layout diagram for high-speed electrolytic copper plating of wire
The key to electrolytic copper plating is the electrodes and their arrangement. A simple power supply but competing with a sulfuric acid electrolysis tank can cause unstable current in the copper plating tank, and the copper plating layer is prone to blooming. The optimal arrangement is for two power sources to supply power. The copper plating tank is connected to the pickling tank and separated independently.
The pickling tank is equipped with an additional rectifier for power supply. In addition, the surface of titanium blue electrolysis must be coated with an iridium tantalum tin conductive layer to make the copper particles in good contact with the conductive layer and conduct current better, so that the copper particles can dissolve well without adding copper sulfate, and the ferrous sulfate will not increase. Otherwise, the copper particles cannot dissolve well and need to be supplemented with copper sulfate. At this time, replacing copper plating will easily cause copper powder to form, and also cause the ferrous sulfate to increase. At the same time, the coating cannot meet the standard and is not corrosion-resistant.
Attachment: Application Study of DW-035C Welding Wire High speed Electrolytic Copper Plating Process in Gas Shielded Welding Wire
The electrolysis process of depositing copper on steel wires, in which the steel wires pass through an acidic electrolysis cell containing copper aqueous solution, and the copper ions come from copper sulfate. Direct current flows through a solution between at least one pair of anodes. The anode is made of titanium blue with copper particles or buckles, and titanium blue needs to be coated with a conductive coating of iridium tantalum tin. And it is necessary to regularly supplement copper particles, and appropriately supplement copper sulfate by analyzing the copper sulfate content in the plating solution (controlling the anode and copper particles well does not require supplementing copper sulfate).
In the acidic copper plating process of steel wire, 'bonding' phenomenon occurs, which is a corrosion and displacement reaction. Copper ions in the solution deposit more preferentially than iron in the wire, and are reduced to metallic copper, while iron is oxidized to ferrous ions and enters the solution. The copper layer deposited on the steel wire in this way has the disadvantage of being powdery and having poor adhesion.
When using the DW-035C welding wire high-speed electrolytic copper plating stabilizer process, there will be no 'bonding' phenomenon, which will not cause copper powder deposition, increase the adhesion between copper and steel wire, and reduce the pores of the copper plating layer. Therefore, the copper plating of the welding wire produced by the new process is not easy to change color, and the corrosion resistance is significantly improved.
And the flow rate of the electrolyte solution between the anode and the cathode is about 0.2 to about 5 meters per second.
The 'electrolytic copper plating' coating has a denser and finer particle coating and excellent adhesion to the surface of the welding wire. The smooth surface of the welding line can reduce resistance, allowing it to smoothly perform at extremely high feed rates during spray arc transfer, which is beneficial for automated welding.
In addition, the quality of crystalline coatings is denser, more uniform, and pore free, thereby avoiding corrosion problems caused by transportation and storage.
In this article, a synergistic effect of 1+1 greater than 2 is achieved through the combination of adsorbents, antioxidants, and strong acids, effectively suppressing the 'iron copper chemical displacement' under acidic conditions. This allows the steel substrate to form a firmly bonded nucleated copper layer at the moment of contact with acidic copper plating solution, rather than a loose sponge copper structure; It is widely known in the industry that sponge copper has no binding force with the substrate and subsequent copper plating layer, while the nucleated copper layer under acidic conditions has good binding force with the substrate; At the same time, an electrochemically deposited electroplating copper layer can be quickly formed on the steel substrate under electrification conditions, resulting in the rapid formation of a dense copper layer on the surface of the substrate, thereby isolating direct contact between the acidic plating solution and the substrate, completely stopping the displacement reaction, and ensuring that the copper layer has a strong bonding force.
After using this new technology, welding wire enterprises can directly reduce costs.
From the above figure, it can be seen that the chemical plating coating is rough, with pores and small pores, but not shiny. The surface of the electrolytic copper plating is shiny and flawless, and the bare wire is not shiny and rough.